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High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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City: Shenzhen
Country/Region: China

High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics

High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics

High conductivity 0.01 mm Ultra Fine Wire Copper Bonding Wire for Electronics and Communications Copper bonding wires are excellent for bonding in a ball / wedge process when using a reduced ...

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0.01 mm Bonding Wire

      

Ultra Fine Wire Bonding Wire

      

Electronics Bonding Wire

      
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