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Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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    Buy cheap Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications from wholesalers
     
    Buy cheap Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications from wholesalers
    • Buy cheap Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications from wholesalers
    • Buy cheap Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications from wholesalers
    • Buy cheap Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications from wholesalers

    Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications

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    Brand Name : WINNER
    Model Number : PW-23
    Certification : ISO9001
    Price : 1~999
    Payment Terms : T/T, Western Union, L/C
    Supply Ability : 1000000 rolls per month
    Delivery Time : 5~8 working days.
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    Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications

    Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications

    The Ultra-Thin High-Conductivity 15-Micron Palladium Coated Copper Wire revolutionizes advanced semiconductor and electronics manufacturing. Engineered with a precision 15μm diameter (1/5th of human hair), this wire delivers gold-level conductivity while offering 30% higher wear resistance than traditional gold wires, ensuring stable signal transmission in high-frequency chip packaging. Its palladium alloy coating enhances oxidation resistance, critical for 5G, AIoT, and aerospace-grade microchips exposed to extreme environments.
    Ideal for fine-pitch bonding in CPU/GPU packaging, MEMS sensors, and medical device modules, it supports ≤40μm pad spacing with zero short-circuit risks. Compliant with ISO 14644-1 Class 5 cleanroom standards, it minimizes ion contamination for automotive-grade semiconductor reliability.

    As a cost-efficient gold alternative, it reduces material costs by 60% without compromising performance. Trusted by global top-tier fabs, this wire combines cutting-edge nano-coating technology with industrial durability, empowering next-gen electronics miniaturization and sustainable production.

    • Gold-plated/palladium bonding wire made of 4N high-purity copper material with a certain proportion of trace elements added;
    • In addition to the characteristics of conventional copper wire, it also has high strength,low curvature, high toughness, and anti-oxidation Chemical characteristics, the arc isimpact-resistant and the welding wire is corrosion-resistant;
    • Surface gold/palladium special bonding wire developed for IC packaging;

    Pd Coated Copper Wire

    Type

    Ø Diameter

    ±1% μm

    Breaking Load

    BL(gf)

    Elongation

    EL(%)

    Length

    Meters

    PW-1

    18(0.7mil)

    >4

    8-14

    500/1000/2000

    20(0.8mil)

    >5

    9-15

    500/1000/2000

    23(0.9mil)

    >7

    10-17

    500/1000/2000

    25(1.0mil)

    >9

    11-17

    500/1000/2000

    30(1.2mil)

    >14

    14-22

    500/1000/2000

    Note: The above Diameter parameters can be customized according to customer requirements.


    Application:

    Applications of palladium-plated copper wire: Can be used in integrated circuits, semiconductor packaging, LED packaging, optoelectronic packaging, etc.

    Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 0

    1.What kind of Enameled copper wire do Winner produce?

    We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.


    2.What's diameters available of the Enamelled copper wire ?

    We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.


    3.What's selfbonding enameled copper wire?

    Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

    by heat or solvents.

    Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

    The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

    as bobbins, tape, varnishing, or impregnation may be eliminated.


    4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

    Of course you can!

    Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 1

    Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 2

    Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 3

    Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 5

    Quality Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications for sale
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