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High toughness Palladium Coated Copper Wire for Semiconductor Bonding Applications

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High toughness Palladium Coated Copper Wire for Semiconductor Bonding Applications

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Brand Name :	WINNER
Model Number :	PW-1
Certification :	ISO9001
Price :	1~999
Payment Terms :	T/T, Western Union, L/C
Supply Ability :	1000000 rolls per month
Delivery Time :	5~8 working days.

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High toughness Palladium Coated Copper Wire for Semiconductor Bonding Applications

High-Toughness Palladium-Coated Copper Wire for Semiconductor Bonding‌

Our advanced ‌palladium-coated copper (Pd-Cu) wire‌ delivers exceptional performance for ‌semiconductor bonding applications‌, combining superior conductivity with unmatched durability. Engineered for ‌high-reliability IC packaging‌, this wire features:

‌Enhanced Toughness‌: 15% higher elongation than standard Pd-Cu wires (tested per JIS Z 2241)
Oxidation Resistance‌: Pd coating prevents Cu diffusion, ensuring stable bonding at 175°C+ (AEC-Q100 qualified)
Cost Efficiency‌: 30% lower material cost vs. gold wire, with equivalent bond strength (25g avg. pull test)

Ideal for ‌automotive electronics, power devices, and MEMS sensors‌, our wire reduces ‌Kirkendall voiding‌ risks while achieving <1% bonding failure rates in HTST (1000h @150°C). Compatible with ‌ASM Eagle60 & KNS Maxμm bonders‌, it supports fine-pitch bonding down to ‌35μm‌.

Gold-plated/palladium bonding wire made of 4N high-purity copper material with a certain proportion of trace elements added;
In addition to the characteristics of conventional copper wire, it also has high strength,low curvature, high toughness, and anti-oxidation Chemical characteristics, the arc isimpact-resistant and the welding wire is corrosion-resistant;
Surface gold/palladium special bonding wire developed for IC packaging;

Pd Coated Copper Wire
Type	Ø Diameter ±1% μm	Breaking Load BL(gf)	Elongation EL(%)	Length Meters
PW-1	18(0.7mil)	>4	8-14	500/1000/2000
	20(0.8mil)	>5	9-15	500/1000/2000
	23(0.9mil)	>7	10-17	500/1000/2000
	25(1.0mil)	>9	11-17	500/1000/2000
	30(1.2mil)	>14	14-22	500/1000/2000

Note: The above Diameter parameters can be customized according to customer requirements.

Application:

Applications of palladium-plated copper wire: Can be used in integrated circuits, semiconductor packaging, LED packaging, optoelectronic packaging, etc.

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 0

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 1

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 2

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 3

High toughness Palladium Coated Copper Wire for Semiconductor Bonding Applications

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