Ultra Fine Wire 0.01mm diameter Gold Bonding Wire for Semiconductor
Packaging
Optimized for high-density semiconductor packaging, this ultra-fine 0.01mm gold bonding wire delivers exceptional electrical conductivity (≤2.4 μΩ·cm) and
mechanical reliability in advanced IC manufacturing. Crafted from 99.999% high-purity gold with trace alloy elements, it ensures stable performance across
extreme temperatures (-55°C to 300°C) and minimizes signal loss in
microelectronics, MEMS devices, and 5G modules.
Featuring a tensile strength of ≥4,200 MPa and ultra-smooth surface finish, this wire reduces breakage risks
during high-speed thermosonic bonding, achieving precise ball
diameters (2.5–3.5φ) and loop heights for sub-micron interconnects.
Its superior fatigue resistance withstands 10,000+ bonding cycles,
making it ideal for automotive electronics, medical sensors, and AI
chip packaging.
ROHS-compliant and compatible with automated wire bonders, it replaces costlier
palladium-coated alternatives while enhancing production yields by
15–20%. Trusted by global semiconductor leaders, this gold bonding
wire sets the standard for miniaturization, durability, and energy
efficiency in next-gen electronics.
Gold (Au) bonding wire is one of the most commonly used types of
wire in the semiconductor industry for creating wire bonds between
a semiconductor die and its package. It is known for its excellent
electrical conductivity, good thermal conductivity, and high
reliability.
Gold bonding wire is typically made from high-purity gold, which
has a purity level of 99.99% or higher. The wire is usually
supplied in spools and is available in various diameters, ranging
from 10 to 40 microns.
Winner offers a wide selection of ball, wedge and stud bonding
wires in a varied portfolio of 4N 99.99 / 3N 99.9 / 2N 99.0.
* Raw materials of high purity (99,999 %)
* Stable mechancial qualities
* Wire surface of high quality
* Made according to customer specifications
* With a diameter down to a size of 0.6 mils / 15 microns for very
fine applications.
* For ball or wedge bonding or stud bumping
The gold bonding wire is a kind of material for semiconductor
packaging which has excellent electrical conductivity, thermal
conductivity, mechanical properties, and chemical stability. This
product is used as an inner lead for packaging and is one of the
essential materials in the manufacturing process of integrated
circuits and semiconductor separators. Winner can provide Au
bonding wire with different wire diameters from 10um-40um according
to customer requirements.
Density: | 19.34 g/cm3 |
Melting Point: | 1063°C |
Electrical Resistivity: (@20°C) | 2.3 μΩ-cm |
Electrical Conductivity: (@20°C) | 75% (IACS) |
Thermal Conductivity: (@20°C) | 315 W/(m-K) |
Fusing Current (10 mm x 25 μm) | 0.52 A |
We take pride in offering a complete range of wire diameters,
thereby fulfilling the diverse needs for strength and elongation in
different wire applications. Moreover, we collaborate closely with
our customers to provide customized solutions. In these custom
solutions, technical parameters such as tensile strength and
elongation are meticulously tailored to meet their specific
requirements. This customer-centric approach enables us to not only
meet but exceed the expectations of our clients in the highly
competitive market of wire manufacturing and bonding applications.
Composition | Diameter | Tensile Strength (gms) | Elongation (%) |
99.99% Au | 0.7 mil | 17.5 μm | 3 - 10 | 2 - 6 |
0.8 mil | 20 μm | 4 - 13 | 2 - 7 |
0.9 mil | 22.5 μm | 5 - 16 | 2 - 8 |
1.0 mil | 25 μm | 6 - 20 | 2 - 8 |
1.3 mil | 32.5 μm | 10 - 45 | 2 - 10 |
1.5 mil | 37.5 μm | 13 - 50 | 2 - 12 |
1.7 mil | 42.5 μm | 15 - 60 | 2 - 12 |
1.8 mil | 45 μm | 20 - 70 | 2 - 12 |
2.0 mil | 50 μm | 25 - 85 | 2 - 15 |
3.0 mil | 75 μm | 50 - 180 | 2 - 20 |
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications
rangining from high pin-count, ultra-fine pitch microelectronic
devices to high-power discrete components. Au is the preferred
choice of bonding material when a) the contact material is not
compatible with Aluminum (Al) and/or Copper (Cu) b) the contact
area is limited c) the device will be subject to high temperature
or high humidity environments.
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
1.What kind of Enameled copper wire do Winner produce?
We focus on research and development of selfbonding magnet round
copper wire, fine polyurethane magnet wire, selfbonding litz copper
wire and selfbonding silk covered wire.
2.What's diameters available of the Enamelled copper wire ?
We specialize in fine and ultra fine enamelled copper
wire,diameters available of our products is Φ0.018-0.50mm.
3.What's selfbonding enameled copper wire?
Selfbonding enamelled copper wire is a special type of enamelled
wire with an additional adhesive enamel overcoat such as
thermoplastic resin.This adhesive has a bonding feature, which is
activated
by heat or solvents.
Once activated the adhesive bonds turn to turn windings into a
compact self supporting coil.
The use of selfbonding wire may offer cost and manufacturing
advantages in some winding applications
as bobbins, tape, varnishing, or impregnation may be eliminated.
4. Is possible to get any sample of selfbonding enamelled copper
wire that you have in production?
Of course you can!
