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Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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    Buy cheap Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics from wholesalers
     
    Buy cheap Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics from wholesalers
    • Buy cheap Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics from wholesalers
    • Buy cheap Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics from wholesalers
    • Buy cheap Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics from wholesalers
    • Buy cheap Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics from wholesalers

    Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics

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    Brand Name : WINNER
    Model Number : WGBW-2
    Certification : ISO 9001, ISO 14001, RoHS
    Price : 1~999
    Payment Terms : T/T, Western Union, L/C
    Supply Ability : 1000000 rolls per month
    Delivery Time : 5~8 working days.
    • Product Details
    • Company Profile

    Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics

    Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics

    Winner can control the diameter of gold bonding wires depending on the customers’ requests. Winner is a leading supplier of metallic bonding wires.
    Winner offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of 5N 99.999 / 4N 99.99 / 3N 99.9 / 2N 99.0.
    * Raw materials of high purity (99,999 %)
    * Stable mechancial qualities
    * Wire surface of high quality
    * Made according to customer specifications
    * With a diameter down to a size of 0.6 mils / 15 microns for very fine applications.
    * For ball or wedge bonding or stud bumping
    The gold bonding wire is a kind of material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. Winner can provide Au bonding wire with different wire diameters from 10um-40um according to customer requirements.

    Physical Properties

    Density:
    19.34 g/cm3
    Melting Point:
    1063°C
    Electrical Resistivity: (@20°C)
    2.3 μΩ-cm
    Electrical Conductivity: (@20°C)
    75% (IACS)
    Thermal Conductivity: (@20°C)
    315 W/(m-K)
    Fusing Current (10 mm x 25 μm)
    0.52 A
    We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
    Composition
    Diameter
    Tensile Strength (gms)
    Elongation (%)
    99.99% Au
    0.7 mil
    17.5 μm
    3 - 10
    2 - 6
    0.8 mil
    20 μm
    4 - 13
    2 - 7
    0.9 mil
    22.5 μm
    5 - 16
    2 - 8
    1.0 mil
    25 μm
    6 - 20
    2 - 8
    1.3 mil
    32.5 μm
    10 - 45
    2 - 10
    1.5 mil
    37.5 μm
    13 - 50
    2 - 12
    1.7 mil
    42.5 μm
    15 - 60
    2 - 12
    1.8 mil
    45 μm
    20 - 70
    2 - 12
    2.0 mil
    50 μm
    25 - 85
    2 - 15
    3.0 mil
    75 μm
    50 - 180
    2 - 20
    Why Gold Bonding Wire?
    Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
    The Advantages of Gold Bonding Wire:
    • Extreme bond reliability
    • A wide processing window
    • Low-impact ball and wedge bonding
    • Superior looping performance
    • High tensile test performance
    • Excellent corrosion resistance
    • Higher fusing current than standard Al bond wire.

    Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 0

    1.What kind of Enameled copper wire do Winner produce?

    We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.


    2.What's diameters available of the Enamelled copper wire ?

    We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.


    3.What's selfbonding enameled copper wire?

    Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

    by heat or solvents.

    Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

    The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

    as bobbins, tape, varnishing, or impregnation may be eliminated.


    4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

    Of course you can!

    Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 1

    Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 2

    Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 3

    Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 5

    Quality Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics for sale
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